Submissions of original work on topics including, but not limited to the following list, are solicited:

  • Electronic structure, X-ray absorption
  • Mechanical properties including vibrational, elastic and piezoelectric properties
  • Thermal properties including thermoelectric behaviors
  • Optical properties
  • Electrical transport phenomena
  • Defect states
  • Structural studies including phase transitions
  • Spin dependent properties
  • Carbon related semiconductors (clusters, nanotubes, graphene)
  • Low-dimensional semiconductor structures
  • Novel materials, structures and devices
  • State of the art computation of material properties under high pressure
  • New experimental and computational techniques

Important Dates

(info updated April 23, 2014)  
HPSP-16 Conference: August 6 -8, 2014
Abstract submission opening: January 16, 2014
Deadline for abstract submission: May 9, 2014
Notice of Acceptance May 27, 2014, all letters have been sent, if you have not received yours send an e mail to
Last day for advanced registration: June 19, 2014
Last day for special hotel rates:  
Manuscript submission starts: July 7, 2014
Visa Application: At least two months before the start of the Conference. For more info click here.